Reballer Kit


This kit is used to reball UFS chips and EMMC/EMCP chips.

Kit includes:

  • 1x OSCAFT TSCAFT Aluminum Foil Tape Acrylic Tin Foil Anti Humidity Rust Eectric Conductivity 10mm 0.06 – 0.1mm thick 50MTS
  • SD-528 low temperature SMT Lead-free SMT Solder Paste 500g Sn42Bi58
  • BGA reballing stencil for, BGA221, BGA529, BGA095, BGA153, and BGA169 layouts.

Part No:
AP-REBALL-KIT

Reballing Tin Plate
Reballing tin plate
Reballing Stencil
Reballing Stencil
Aluminum Foil Tape
Aluminum Foil Tape
Reballing Stencil
Low-Temp Lead-free SMT
Solder Paste


 

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