Join Teel Technologies for our new class on removing memory and other IC chips from devices using “no heat” processes. This two-day class provides participants with the necessary education into latest chip and removal trends, and the essential polishing, milling and reballing skills.
Largely a hands-on class, students will spend significant time with both polishing and milling machines, and practicing reballing for reads. Students considering this class should be experienced in chip removal and have a fundamental knowledge of proper chip handling during removal and preparation.
A certification of completion is issued at the conclusion of class, and students receive an essential kit for reballing and handing of chips.
Why No Heat Methods?
As chips with limited heat cycles, or low heat thresholds continue to be more common, the requirement to remove them in a safer way is essential to successful examinations.
Damaged chips requiring repair before read, as well as those secured with difficult or large amounts of epoxy, are both removed in a safer way through non-heat methods.
Students will have the opportunity to remove chips using polishing and milling tools, learn how to reball and prep for reading, and conclude with acquiring data.
Review of Chip Off process
Introduction to UFS chips
Alternative way to reball a chip
Non heat chip removal using the milling process
Non heat chip removal with the polishing process
Demos and student hands on practical of both processes
Continued milling and polishing practice
Using the Medusa Pro for chip off reads
Alternative Reading Tools for chip off
Introduction of DediProg UFS reader with student practical
Laptop Minimum Requirements
We encourage students to bring their own laptops whenever possible. If this is not possible, TeelTech will provide one for you. If you do plan on bringing your own laptop, indicate so on the registration page and please ensure the meet the following requirements.