Cold Chip-off Training

 

Join Teel Technologies for our new class on removing memory and other IC chips from devices using “no heat” processes. This two-day class provides participants with the necessary education into latest chip and removal trends, and the essential polishing, milling and reballing skills.

Largely a hands-on class, students will spend significant time with both polishing and milling machines, and practicing reballing for reads. Students considering this class should be experienced in chip removal and have a fundamental knowledge of proper chip handling during removal and preparation.

A certification of completion is issued at the conclusion of class, and students receive an essential kit for reballing and handing of chips.


BGA Chip-off Forensics


Why No Heat Methods?

As chips with limited heat cycles, or low heat thresholds continue to be more common, the requirement to remove them in a safer way is essential to successful examinations.

Damaged chips requiring repair before read, as well as those secured with difficult or large amounts of epoxy, are both removed in a safer way through non-heat methods.

Students will have the opportunity to remove chips using polishing and milling tools, learn how to reball and prep for reading, and conclude with acquiring data.

Course Outline

Day 1

  • Review of Chip Off process
  • Introduction to UFS chips
  • Alternative way to reball a chip
  • Non heat chip removal using the milling process
  • Non heat chip removal with the polishing process
  • Demos and student hands on practical of both processes

Day 2

  • Continued milling and polishing practice
  • Using the Medusa Pro for chip off reads
  • Alternative Reading Tools for chip off
  • Introduction of DediProg UFS reader with student practical

Laptop Minimum Requirements

We encourage students to bring their own laptops whenever possible. If this is not possible, TeelTech will provide one for you. If you do plan on bringing your own laptop, indicate so on the registration page and please ensure the meet the following requirements.


Laptop Requirements:

  • Windows 7
  • Windows 8.x and 10.x using these instructions
  • macOS with Bootcamp Windows 7
  • macOS with Bootcamp Windows 8.x and Win 10.x using these instructions
  • macOS alone will not work (No Virtual Machines)
  • 8GB RAM (minimum)
  • 100GB storage (minimum)
  • You must have admin rights or have the admin password for software installation.
  • NOTE: ALL Windows updates should be done prior to class

Optional:

  • Cellebrite P.A. Dongle
  • Encase, FTK, X-Ways Dongle
  • Access to a HEX editor
  • External USB 3.0 Storage Device



A Preview of the Reballing-Tinning Process and Polishing

Watch mobile forensic expert Bob Elder walk you through the 2 stage reballing-tinning process of BGA Chips.

2 Stage Reballing-Retinning of BGA Chips

Non-Heat Polishing & PCB Removal


This class is for Law Enforcement and Government Officials ONLY.
For questions regarding this policy, please contact us at info@teeltech.com or (203) 855-5387.

 


Course Offerings