Reballer Kit


This kit is used to reball UFS chips and EMMC/EMCP chips.

Kit includes:

  • 1x eMMC / eMCP SCP-6 Solder Cleaning Platform
  • 1x OSCAFT TSCAFT Aluminum Foil Tape Acrylic Tin Foil Anti Humidity Rust Electric Conductivity 15ft long 1 inch wide
  • SD-528 Low Temperature SMT Lead-Free SMT Solder Paste 500g Sn42Bi58
  • BGA Reballing Stencil For: BGA221, BGA529, BGA095 and BGA153/169 Layouts

Part No:
AP-REBALL-KIT

Reballing Tin Plate
Reballing tin plate
Reballing Stencil
Reballing Stencil
Aluminum Foil Tape
Aluminum Foil Tape
Reballing Stencil
Low-Temp Lead-free SMT
Solder Paste

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