Reballer Kit

This kit is used to reball UFS chips and EMMC/EMCP chips.

Kit includes:

BGA reballing station Chip holder with magnetic repair base
500 g Lead Free SMT low heat solder paste
Stencils for BGA153, BGA162, BGA169, BGA186, BGA221, BGA254

Part No:
AP-REBALL-KIT

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